Solder balls forming under chip capacitor due to excessive paste - Surface Mount Process
Bob Willis Solder Paste Defect Video - Solder Balls or Fines
Mid chip solder ball or bead forming under SMT resistor during reflow soldering
Bob Willis Solder Paste Defect Video - Paste Slump
Analysis of the causes of tin beads in SMT reflow soldering
Tombstone of chip capacitor during reflow soldering - Surface Mount Process
Chip Capacitor's Solder Journey
Voids forming under DPAK due to outgassing during solder reflow
Bob Willis Solder Paste Defect Video - Solder Balls and Fines
SMT : Sample #09 BGA ball melting in Reflow
DPAK soldering and formation of solder ball due to too much paste - Surface Mount Process
Pin-in-Paste - Connector drop during Intrusive Reflow
01005 Component Rework Using Solder Balls
Bob Willis Solder Paste Defect Video - Solder Beads
Solder Wetting of Surface Mount IC during Reflow Soldering
Causes and solutions for solder paste misalignment defect
The Principle of Laser Solder Ball Welding
Bob Willis Solder Paste Defect Video - Poor Print Deposit
Bob Willis Solder Paste Defect Video - PTH Voiding in PIHR
Bob Willis Solder Paste Defect Video - Poor Paste Separation
