Reflow Soldering Defect - Chip capacitor tombstone
SMT : Sample #05 Tombstone defect 002
Mid chip solder ball or bead forming under SMT resistor during reflow soldering
Tombstone of chip capacitor during reflow soldering - Surface Mount Process
SMT : Sample #09 BGA ball melting in Reflow
Reflow of Chip Component
Solder balls forming under chip capacitor due to excessive paste - Surface Mount Process
Most common defects (tombstone and solder Ball) during SMT soldering process in reflow oven.
Solder Wetting of Surface Mount IC during Reflow Soldering
Reflow Soldering of Chip Capacitor - Surface Mount Process
SMT Defectives_Updated video
SMT : Sample #01 Tombstone defect 001
Bob Willis Blocked Holes Defect of the Month 2019
10 solder paste printing process defects and solutions - under 3 mins!
Reflow Soldering Machine | SMT Reflow Soldering Process | Surface Mount Technology
Making of a Solder Ball on a DPAK
Bob Willis Solder Paste Defect Video - Solder Balls and Fines
Voids forming under DPAK due to outgassing during solder reflow
Repairing a Dry, Cold or Cracked Solder Joint & how to identify it - 2021
Defect of the Month 9 - Non-reflow of solder paste
